Stock Removal Slurries

SS2000 B

  • pH: 11.25

  • Density: 1.1955

  • Viscosity (cps): 5

  • Particle Size (nm): ~ 60

SS2000 B and SS2000 N for “high performance/cost saving” stock polishing

SS2000 N

  • pH: 11.2

  • Density: 1.1955

  • Viscosity (cps): < 10

  • Particle Size (nm): ~ 50

SS2000 B and SS2000 N for “high performance/cost saving” stock polishing

SS2000 UL

  • pH: 11.4

  • Density: 1.195

  • Viscosity (cps): < 10

  • Particle Size (nm): ~ 55

SS2000 UL & SS2000 UM are good for virgin & reclaim wafer polishing if requirement of low residual metals is a must.

SS2000 UM

  • pH: 11.4

  • Density: 1.195

  • Viscosity (cps): < 10

  • Particle Size (nm): ~ 40

SS2000 UL & SS2000 UM are good for virgin & reclaim wafer polishing if requirement of low residual metals is a must.

Final Polish Slurries

FS2020

  • pH: 10.6

  • Density: 1.031

  • Viscosity (cps): < 50

  • Particle Size (nm): ~ 60

FS2020 and FS2035 is a cost saving replacement of commercial slurries. Big saving can be utilized if use FS2020.

FS2020 U

  • pH: 10.6

  • Density: 1.031

  • Viscosity (cps): < 50

  • Particle Size (nm): ~ 55

FS2020 U and FS2035 U are good for ultra low metals, high performance, and cost saving final polishing slurries.

FS2035

  • pH: 10.5

  • Density: 1.051

  • Viscosity (cps): < 25

  • Particle Size (nm): ~ 50

FS2020 and FS2035 is a cost saving replacement of commercial slurries. Big saving can be utilized if use FS2020.

FS2035 U

  • pH: 10.5

  • Density: 1.051

  • Viscosity (cps): < 25

  • Particle Size (nm): ~ 55

FS2020 U and FS2035 U are good for ultra low metals, high performance, and cost saving final polishing slurries.

Surface Enhancement Agent

MM7412

  • pH: 10.5

  • Viscosity (cps): < 28

MM7412 is a post-polish agent effective in reducing surface haze, improving surface quality and enhancing particle reduction.