Stock Removal Slurries
SS2000 B
- pH: 11.25
Density: 1.1955
Viscosity (cps): 5
Particle Size (nm): ~ 60
SS2000 N
pH: 11.2
Density: 1.1955
Viscosity (cps): < 10
Particle Size (nm): ~ 50
SS2000 UL
pH: 11.4
Density: 1.195
Viscosity (cps): < 10
Particle Size (nm): ~ 55
SS2000 UM
pH: 11.4
Density: 1.195
Viscosity (cps): < 10
Particle Size (nm): ~ 40
Final Polish Slurries
FS2020
pH: 10.6
Density: 1.031
Viscosity (cps): < 50
Particle Size (nm): ~ 60
FS2020 U
pH: 10.6
Density: 1.031
Viscosity (cps): < 50
Particle Size (nm): ~ 55
FS2035
pH: 10.5
Density: 1.051
Viscosity (cps): < 25
Particle Size (nm): ~ 50
FS2035 U
pH: 10.5
Density: 1.051
Viscosity (cps): < 25
Particle Size (nm): ~ 55
Rinse Inhibitor
MM7412
pH: 10.5
Viscosity (cps): < 28
Notes
SS2000 B and SS2000 N for “high performance/cost saving” stock polishing
SS2000 UL & SS2000 UM are good for virgin & reclaim wafer polishing if requirement of low residual metals is a must.
FS2020 and FS2035 is a cost saving replacement of commercial slurries. Big saving can be utilized if use FS2020.
- FS2020 U and FS2035 U are good for ultra low metals, high performance, and cost saving final polishing slurries.
- MM7412 is used for replacing existing protecting agent and huge cost saving.