Technical Resources Northwest, LLC

Serving the Semiconductor Industry

Stock Removal Slurries

SS2000 B

  • pH: 11.25

  • Density: 1.1955

  • Viscosity (cps): 5

  • Particle Size (nm): ~ 60

SS2000 B and SS2000 N for “high performance/cost saving” stock polishing

SS2000 N

  • pH: 11.2

  • Density: 1.1955

  • Viscosity (cps): < 10

  • Particle Size (nm): ~ 50

SS2000 B and SS2000 N for “high performance/cost saving” stock polishing

SS2000 UL

  • pH: 11.4

  • Density: 1.195

  • Viscosity (cps): < 10

  • Particle Size (nm): ~ 55

SS2000 UL & SS2000 UM are good for virgin & reclaim wafer polishing if requirement of low residual metals is a must.

SS2000 UM

  • pH: 11.4

  • Density: 1.195

  • Viscosity (cps): < 10

  • Particle Size (nm): ~ 40

SS2000 UL & SS2000 UM are good for virgin & reclaim wafer polishing if requirement of low residual metals is a must.

Final Polish Slurries

FS2020

  • pH: 10.6

  • Density: 1.031

  • Viscosity (cps): < 50

  • Particle Size (nm): ~ 60

FS2020 and FS2035 is a cost saving replacement of commercial slurries. Big saving can be utilized if use FS2020.

FS2020 U

  • pH: 10.6

  • Density: 1.031

  • Viscosity (cps): < 50

  • Particle Size (nm): ~ 55

FS2020 U and FS2035 U are good for ultra low metals, high performance, and cost saving final polishing slurries.

FS2035

  • pH: 10.5

  • Density: 1.051

  • Viscosity (cps): < 25

  • Particle Size (nm): ~ 50

FS2020 and FS2035 is a cost saving replacement of commercial slurries. Big saving can be utilized if use FS2020.

FS2035 U

  • pH: 10.5

  • Density: 1.051

  • Viscosity (cps): < 25

  • Particle Size (nm): ~ 55

FS2020 U and FS2035 U are good for ultra low metals, high performance, and cost saving final polishing slurries.

Rinse Inhibitor

MM7412

  • pH: 10.5

  • Viscosity (cps): < 28

MM7412 is used for replacing existing protecting agent and huge cost saving.

Company History

Technical Resources Northwest began as a services company designed to offer services to the semiconductor industry. The primary objective focused on the materials side of the industry. Semiconductor substrate manufacturing and the consumables used to cut, lap and polish semiconductor substrates. TRN offered recommendations for consumables and the application of those products for wafer polishing and cleaning processes.

TRN also assisted substrate companies source equipment for polishing and cleaning semiconductor wafers. As the customer base grew there were opportunities for TRN to identify and recommend process and consumables changes. In 2016 TRN formulated a wafer cleaning additive that improved the cleaning process after polish.

Wafer polishers noticed a significant improvement in the cleaning process. TRN opened a manufacturing facility in Oklahoma and started the production of a cleaning agent.

As the use of the cleaning agent continued to grow, customers asked for other formulated products.

A customer and manufacturer collaborative took shape, and TRN began to provide additional polishing products. Finish polish processes were the next priority. TRN worked closely with wafer polishing companies to formulate finish polish products that would achieve the process results and final wafer quality demanded by the semiconductor industry.

Since the introduction of our cleaning products, TRN has added additional polishing products.

TRN continues to work closely with our customer base to formulate new polishing products that provide our customers with a viable option at a competitive price.

All TRN products are made in America and the materials that go into TRN products are sourced from US suppliers. TRN strives to source multiple qualified suppliers and maintain a reliable supply chain of raw materials.

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